Used ASM AD 896 #9362992 for sale

ASM AD 896
Manufacturer
ASM
Model
AD 896
ID: 9362992
Die bonder.
ASM AD 896 is a fully automated die attach machine for the process of attaching semiconductor die to package substrate. It is designed for high-volume, low-cost, high-speed die attaching, enabling maximum throughput and efficiency. This machine includes an on-board computer with touch-screen controls for easy operation and the latest motion-control technology for accurate and repeatable positioning of the die and substrate. The machine is designed with a flexible transport equipment that provides up to four die edges to be transported simultaneously and helps to reduce loading time. The flexible transport system can also be used for accommodating a wide variety of die sizes. ASM AD896 is equipped with four independent heads and an x-y-z axis assembly that provides precise control of the die displacement during the attaching process. Each head can move +/- 10 x 10 µm and can hold up to 10 dies. Die sizes that can be handled by the machine range from 2 x 2 up to 20 x 20 mm. The machine includes a cleaning module for the substrate, as well as an automatic camera unit that inspects the back side of the substrate for any blemishes or defects. The machine also features a vacuum tool for controlling the die placement. After the die has been attached, the x-y-z axis assembly moves to the next die placement point and the process is repeated. AD 896 is capable of handling up to 800 die placements per minute and can be easily integrated into any automated line. With its minimal set-up times and easy to use touch-screen interface, the machine is an essential tool for efficient die attach fabrication. Furthermore, its precision placement capability ensures superior quality and accuracy, allowing for reliable and repeatable results.
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