Used ASM AD 896M-IL08 #293671779 for sale

ASM AD 896M-IL08 is an automatic die-attaching machine designed to perform repeatable and reliable die bonding of semiconductor components. It has been designed specifically to meet the high standards of the semiconductor industry for producing medium to large quantity batches of high-yield products. AD 896M-IL08 is equipped with a full range of features to ensure that dies are accurately and quickly placed and then bonded onto wafers. This includes a bonding chamber, bonding head, pick and place unit, vision system, and a delamination unit. The bonding chamber is fully programmable and features a temperature range of up to 150°C. The bonding head is adjustable and typically used for connecting together dies and packages. The pick and place unit is equipped to position the dies accurately onto the wafers. This unit has a positioning accuracy of within 5 micrometers and speeds of up to 2000 die/min. The vision system is used to identify and confirm the exact die placement on the wafer, enabling subsequent defect checks and corrections to be minimised. Additionally, it can be used to detect any overload or warping of the dies. The delamination unit prevents excessive die warping during the bonding process. This unit maintains the correct amount of force on the dies at all times, ensuring the predetermined amount of bond formed. ASM AD 896M-IL08 is operated via a graphical user interface (GUI) which is compatible with the process recipe editor. This means that the machine is easy to configure and control. It also has several programmable utilities for optimum performance, such as temperature monitoring, automated die testing, vehicle detection, and performance optimization. Additionally, it is capable of collecting statistical process data and has integrated error detection systems. Overall, AD 896M-IL08 is a reliable and robust die-attaching machine designed for the semiconductor industry. It is perfectly suited for high-volume production requirements and features a full range of advanced features for precise and consistent die bonding of wafers.