Used ASM AD 896M-IL08 #9171591 for sale

ASM AD 896M-IL08 is a die attacher which is designed to adhere a chip to a substrate by a localized bonding process known as hard soldering. This process ensures maximum mechanical and electrical connection between the substrate and the chip. AD 896M-IL08 uses an electrochemical process to apply a solder alloy to the substrate and the chip to create a strong bond. The process includes the die attacher applying electrolytic flux onto the substrate and the chip which aids in the fusion of the alloy to the surface. The distance between the chip and the substrate is then reduced to a very small amount, typically 0.2 mm, to create a wedge-like shape of the solder joint. ASM AD 896M-IL08 also applies peak power heat pulsing technology to the solder joint to further ensure the strongest bond possible. This process involves to equipment to apply a peak pulse of high thermal energy to the solder joint in order to increase the temperature and liquidify the solder powder. This step creates an even and uniform bond by filling any remaining gaps between the chip and the substrate. AD 896M-IL08 also features a dual vision system for extreme accuracy. Each substrate/chip combination to be soldered is imaged twice before the process begin. This ensures that even the tiniest of shapes are identified and precision soldering can be achieved. Additionally, intelligent position correction is implemented throughout the process to further ensure that precise soldering is achieved. In addition to its reliable soldering process, ASM AD 896M-IL08 also features a programmable LED scanning unit which is used to inspect the solder joints for consistency, adhesion and integrity. This LED scanning machine can detect any inconsistencies before the final process is in checked and the chip is securely attached to the substrate. AD 896M-IL08 is a reliable and effective die attacher that offers an excellent solution for chip-on-wafer applications. It provides a strong electrical and mechanical connection by using an electrochemical process and peak power heat pulsing, and offers high accuracy via its dual vision tool and intelligent position correction. It also offers piece-of-mind by providing a programmable LED scanning asset to inspect the solder joints for any imperfections.