Used ASM AD 896M-IL08 #9314280 for sale
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ID: 9314280
Vintage: 2007
Die bonder
Multi wafer type (4-Type wafer)
Epoxy stamping
Loader / Unloader
2007 vintage.
ASM AD 896M-IL08 is a state-of-the-art die attacher designed to meet the needs of a variety of industries. The device offers semi-automatic and full-automatic die attachment capabilities, making it an ideal solution for applications such as packaging, medical device production, and chip fabrication. AD 896M-IL08 is comprised of a pick-and-place head assembly, X, Y, and Z axes for precision placement, a die-holding chuck, a precision vision system, a programmable controller, and a force sensors. A separate control panel allows the user to manually control the die placement or operate it in a fully automatic mode. The pick-and-place head assembly is designed to securely hold die up to 25mm in size, and mount them to the substrates of various sizes. It is equipped with a vision system and provides a reliable method for accurately aligning die to the substrates. The X, Y, and Z axes maintain precise die location and secure attachment, while the die-holding chuck securely mounts die for quick and easy pick-up. The powerful programmable controller allows for fine adjustment of the pick-and-place head, as well as control of the force sensors which are used to detect and measure substrate and die loading. The built-in force sensor allows the device to be finely tuned for optimum performance, and prevents damage to substrates and dies which may result from excessive force. Overall, ASM AD 896M-IL08 is a reliable, high-performance die attacher for a variety of applications. Its pick-and-place head assembly, vision system, and programmable controller provide precise placement accuracy and secure attachment. The built-in force sensors ensure a secure attachment without damaging the substrates and dies, while the ergonomic design make it both comfortable and safe to operate.
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