Used ASM AD 896M-IL08 #9329158 for sale

ASM AD 896M-IL08 die attacher is designed for precisely and accurately placing Flip-Chip Solder-Bump Die onto printed circuit boards (PCBs). It is a high performance attachment equipment that features a high-speed, multiaxis motion control system, integrated vision cameras, and a tooling pin placement head. The die attacher is compliant with the IPC-A-610E requirements for reliability and quality, making it suitable for high-end assembly and reliable operations. The device has a maximum die size of 0.8"x0.8"(20mm x 20mm), and can be used on PCBs up to a size of 10"x15" (254mm x 380mm). The specialised vision cameras on the hardware are capable of precise placement of the die with a minimum ±0.00004" (±1µm) accuracy, allowing for reliable placement of components. The device also has a number of pre-programmed tooling pin placement heads that can be tailored according to the application requirements. The die attacher can be integrated with any SMEMA compatible pick-and-place unit. It is also able to operate in high-collision zones, where the tooling pin placement heads are capable of detecting metallic and non-metallic components and avoid collisions/damages. The device includes a graphical user interface for setting up and controlling the die placement process. The user can learn the machine quickly and read the real-time production capability of the tool, allowing for monitoring of production speed and quality. The device also includes a logging asset for storing critical product data such as fault code messages and production history. AD 896M-IL08 die attacher is an efficient and reliable industrial solution for high-end assembly applications such as cellphone enclosure assembly, RFID embedding, and automotive device integration. It is a reliable and strongly built hardware that ensures consistent performance and high-precision die placement for various product development needs.