Used ASM AD 898 #293671780 for sale

ASM AD 898
Manufacturer
ASM
Model
AD 898
ID: 293671780
Wafer Size: 6"
Vintage: 2003
Die bonders, 8" 2003 vintage.
ASM AD 898 is an automated die attach machine used for applying precision-mounted dies to components or substrates. It is suitable for a wide range of bonding technologies, such as gold-tin, lead-tin, eutectic die attach, and other thermal or ultrasonic die attach processes. The machine features integrated robotic equipment capabilities, providing unattended, reliable component or substrate positioning and die attach cycle control. It consists of two robots, one for die placement and one for substrate positioning and loading/unloading. ASM AD898 is designed with an automated temperature control feature, which enables the user to adjust the curing temperatures during the die attach process. It also offers an integrated vacuum functional option for controlling the attachment of the die. With its pre-programmed cycle times, the interface options enable a smooth and fast die attach process. The machine's adjustable slider enables easy access to all work areas for cleaning or maintenance, while the robustly built housing provides a high degree of protection against shock and vibration. AD 898 offers multiple benefits for a wide range of applications. Its automated system provides accuracy and high precision, ensuring repeatability and reducing the time spent on manual operations and other tasks. It is a flexible unit, as it is capable of handling multiple substrate materials, as well as multiple die sizes. Additionally, it is designed for easy maintenance, with accessible parts and modules requiring only basic tools for servicing. Last but not least, it is an energy efficient machine, as it consumes only a low amount of power in idle mode. AD898 is designed for users who require an automated die attach tool that is highly accurate, efficient and easy to maintain. With its programmable parameters, user-friendly interface and robust construction, this machine makes it easier for manufacturers to attach different sized substrates or dies in a short amount of time.
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