Used ASM AD 898 #9302085 for sale

ASM AD 898 is a die attacher specifically designed for the fast, precise and reliable attachment of chip dies to a substrate. It is a lightweight and versatile machine, capable of handling dies of various sizes. The machine uses a nozzle-mounted, dual-camera equipment to accurately scan and identify the chip dies, while two image processing systems compare captured images to a reference image. Once the die is identified, the machine uses a vacuum pump system to pick up the die from the tray and move it to the substrate. A servo-controlled device then places the die on the substrate in a precise manner, ensuring that it is properly situated and level. A die attach die-wetting station then proceeds to dip the die in a die-wetting solution, providing a low-contact surface finish that helps ensure optimal electrical conductivity. In order to ensure quality control, ASM AD898 is equipped with two optional components: a vision unit and a die attach die-wetting monitor. The vision machine allows for the inspection of each die before the attachment process begins to ensure they are free from damage and defect. The die attach die-wetting monitor inspects the die after attachment to ensure the stable surface finish is maintained. For effective operation and optimised performance, AD 898 comes with a range of features and functions. These features include an algorithm that allows for the simultaneous pick-up of multiple dies of different sizes from the same tray, as well as a motion control tool that enables higher speeds in die attachment. It also includes a remote integration module, allowing asset controls to be accessed over a network and for the machine to be monitored and optimised from a remote location. AD898 provides a highly efficient, cost-effective and reliable mechanism for die mounting. It is suitable for use in a variety of applications including chip package assembly and model-in-package assembly.