Used ASM AS 899 #9409500 for sale

ASM AS 899 is an automated die attacher used for die bonding in the semiconductor industries.It offers a cost-effective and efficient solution for assembling miniature dies for applications such as wafer packaging, memory chips and logic. ASM AS899 is designed to bond any sized die to a carrier with a high precision Plunger Actuating Equipment (PAS). The PAS uses a precision spring and plunger system to provide a low-deflection bond on the die for a low bond resistance and improved reliability. The PAS also allows for quick self-adjustment of the height of the die as well as rotation of the die. AS 899 also provides users with an intuitive, user-friendly operator-assist mode (OAM) to eliminate the need for manual operations. The OAM allows the operator to manually input parameters, create bond cycles and select the bond sites. It also allows the operator to monitor and control the progress of the process. Additionally, the OAM includes a pressure monitoring tool to ensure consistent results of the die bonding process. AS899 is equipped with a closed-loop temperature control unit that ensures accurate and repeatable temperature control. This temperature control machine allows for precise set temperature for processing temperature-sensitive materials with minimal heat distortion. ASM AS 899 also features an improved die pre-treatment option that allows for better adhesion between the die and carrier. This process ensures high mechanical stability of the die during application of force, significantly reducing die deformation. Additional features of ASM AS899 die attacher include a rapid die-to-die loading function and a quick changeover between different die size platforms. The rapid die-to-die loading function improves operational efficiency and allows for quicker assembly times. The quick changeover between different die size platforms allows for on the fly adjustment for processes using different wafer sizes. In many industries, the automated die-attaching process is becoming increasingly important as the size of components become smaller and more intricate. AS 899 is designed to meet the demanding requirements of these industries and provides a cost-effective and highly efficient solution for die bonding processes.