Used ASM DB 100 #293656566 for sale

ASM DB 100 is a die attacher which allows for fast and efficient die bonding to substrates. It is a precision die bonding equipment specifically designed for attaching die to a wide variety of substrates. DB 100 is equipped with an integrated vision system which provides positional feedback, allowing for precise positioning of die with respect to substrate contacts. It also features a unique double head feeding unit which increases throughput and laser die sorting capabilities. The machine is equipped with a real-time three-dimensional imaging machine which allows for precise control over the bonding parameters. The vision tool ensures accurate die placement on the substrate. This allows for effective laser die sorting which allows for accurate and precise die bonding. The asset is capable of accommodating substrates up to 200mm x 200mm with a die pitch of between 0.3 mm and 2.0 mm. The integrated vision model is also capable of aligning die to substrate contacts selected by a user. ASM DB 100 is equipped with a powerful and reliable die attach equipment, providing the ability to bond die with various adhesives. This die attach system is capable of heating die quickly and efficiently with either hot gas, infrared or UV laser. The die attach unit is designed to enable precise die placement regardless of the number of die bonded. The user interface of DB 100 is intuitive, allowing users to quickly and conveniently set the required parameters. The software is easy to use and offers features such as automated optimization, real-time monitoring and feedback, as well as support for up to 32 different die attach applications. Additionally, the software includes an automated self-test procedure to verify accuracy and reliability. Overall, ASM DB 100 die attacher provides a highly efficient and accurate solution for attaching die to a variety of substrates. Its unique double head feeding machine combines with its integrated vision tool and adaptable die attach asset to provide accurate and reliable die bonding. With its powerful and intuitive user interface, the machine is capable of providing the user with a fast and efficient solution for die bonding.