Used ASM MS 100 Plus #9185962 for sale
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ID: 9185962
Dual-arm map sorters
System:
Cycle time: 125 ms*
XY Placement: ±1.5 mil (±38 µm)
Die rotation: ±3°
Maximum picking area: φ 6.2" (157 mm)
Wafer loader capacity:
(25) Wafer frames
(12) Foton rings
Die size handling:
Standard: 9x9 - 160 x 160mil (0.2x0.2 - 4.0x4.0 mm)
Option: > 160 x 160 mil (> 4.0 x 4.0 mm)
Collet type: Surface pick
PR System: 256 Grey level
Angle tolerance: ±10°
Binning system:
(200) Maximum bin loaders
(150) Buffer bin cassettes
(25) Empty bin cassettes
(25) Finished bin cassettes
Bin frame size: 195 x 195 mm (Standard)
Effective binning area: 80 x 80 mm
Sorting speed: 125ms (Single bin sorting)
Voltage: 100 - 240 VAC
Current:
Average: 3.9 A® 220 VAC
Maximum: 5.9 A® 220 VAC
Power consumption:
Average: 850W
Maximum: 1300W
Frequency: 50/60Hz (Pre-set at factory)
Power cord
Compressed air: 87 PSI (6) Bars
Air consumption: 155 LPM & (4) Bars
Inlet.
ASM MS 100 Plus Die Attacher is an automated semi-automatic industrial machine used for the die attaching process. It is equipped with an ultrasonic transducer which is used to generate a low frequency sound wave to create sufficient heat to create an ultrasonic bond between a die and a substrate. MS 100 Plus has a maximum capacity of attaching up to 1,200,000 dies per hour. It is designed to work with a wide range of substrates including, but not limited to, plastics, glass, metals and ceramics. ASM MS 100 Plus consists of two separate but connected components. The first component is the die attach unit which is positioned directly above the substrate. This unit has an oscillating head which is responsible for generating the low-frequency sound waves and heating electrons. The head is connected to a control unit which is used to monitor and adjust the parameters such as the pressure and the frequency of the ultrasonic wave during the die attach process. The second component is the substrate delivery system which consists of a belt that contains the substrate and directs it into the die attach unit. MS 100 Plus offers high-precision die attaching capabilities through a wide range of parameters including, but not limited to, the pressure duration, the frequency of the ultrasonic wave, and the heating rate. These parameters can all be controlled with the control unit to ensure precise and accurate die attachers. Additionally, ASM MS 100 Plus includes a range of safety features to protect both the machine and the operator. MS 100 Plus is a reliable and efficient die attacher for use in a number of industries such as automotive and electronics. It is considered to be a cost-effective solution for users as it is capable of producing high-quality dies at a fast rate. With its robust design and wide range of parameters, ASM MS 100 Plus is an ideal choice for companies looking to improve production rates and optimize their process.
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