Used ASM MS 100 Plus #9364713 for sale

ASM MS 100 Plus is a high-performance die attacher designed to be easy to operate, reliable, and flexible. It is ideal for a variety of applications, including die bonding and wire bonding. This versatile machine provides an efficient and cost-effective way to attach and remove dies on semiconductor packages. It is suitable for through-hole, surface-mount, and flip-chip die attach processes. MS 100 Plus uses a high-performance vision equipment and powerful software to accurately locate and attach dies. This system is capable of accurately detecting and locating dies up to 0.3 millimeters in size and placing them with high accuracy. Additionally, the machine is designed with a patented chip pinning technology which can reduce assembly time and improve process accuracy. The machine is equipped with a high-speed scara robot which is capable of quickly and accurately placing dies up to 0.75 millimeters in size. It also features an integrated vision correction unit and a vacuum based die attach machine which can detect and place dies at high speed. The vision tool can also be used to verify die bonding quality and locate and attach nested die. ASM MS 100 Plus features a user-friendly interface and can be programmed quickly and easily. The machine has a wide range of tooling available, including tweezer tips, nozzles, stencils, and rollers. It is also compatible with most major die packaging equipment. MS 100 Plus is a powerful and reliable solution for die attach applications. It is designed to be robust and capable of withstanding high production volume. It is also designed with multiple safety features to protect operators and equipment. The cost-effective and versatile nature of the machine make it a great choice for die attach applications.