Used ASM MS 100 #293823962 for sale

ASM MS 100 is an automated inline die attacher designed for die-bonding applications. This die-bonding machine attaches die to lead frames or other substrates for semiconductor packages, including chip-on-board and leadless chip carriers. It is capable of dispensing as few as one micron-sized die, as well as attaching large die up to .8 inches in diameter. The equipment uses a precision nozzle for die pickup and accurate placement, along with a self-centering pick-up assembly for reliable die-alignment accuracy. ASM MS100 has an accuracy of plus or minus 25 microns, giving it superior accuracy compared to other die-attaching systems. It also has a built-in autocalibration system that ensures reliable operation and repeatability throughout its life-cycle. The unit offers programmable parameters such as nozzle speed, die height, pressure, time, viscosity and dwell time. MS 100 is a modular machine design that allows it to be configured with different feeders and packages, allowing it to be used for various odd-form component applications. It offers a variety of options to configure the machine to the customer's specific needs, such as rotary or linear feeders, and manual, semi-automated or fully automated operation. The machine has an easy-to-use, graphical user interface (GUI) for fast setup, programming, and operation. Its self-diagnostic function makes it easy to troubleshoot any problem and its "no operator input required" feature alleviates the need for manual touchup or reflow work. MS100 is designed with safety in mind. It is equipped with a two-hand grip area on the side and a lid covering the bowl to protect the operator. The die-attaching tool also comes with a sound detector that emits a sound when the machine is in motion. ASM MS 100 is an ideal solution for high-volume, high-precision, chip-on-board, and leadless chip-carrier attachment applications. It offers reliable and repeatable performance in a range of packages, and its user-friendly GUI simplifies operation and makes it an ideal choice for any die-bonding operation.