Used ASM MS 100 #9168192 for sale

ASM MS 100 is a die attacher that is designed to automate the die attachment process for a variety of applications and products. The machine is equipped with a servo-drive equipment that can quickly and accurately position and attach components to substrates. The die alignment and pick and place process is controlled by a stand-alone controller with a color touch screen display. ASM MS100 has a die attach area with a variable area of 600mm x 600mm, and can accommodate chip sizes ranging from 0.5 mm x 0.5 mm up to 32 mm x 32mm. The die attach head is equipped with an auto-level compensation feature, enabling accurate adhesive placement and uniform bonding results. The vacuum retention system ensures that the parts are firmly attached, even in high-density environment. MS 100 can be configured to support a variety of materials, such as FR4, glass epoxy (G/E), and ceramic substrates. The machine can also be programmed to support a variety of die attach methods, including thermosonic ball attach, thermocompression, epoxy attach, and solder ball attach. The deep access feature allows users to process ultra-small components, such as Bumps and WLCSP, without damaging the component or the substrate. The accuracy and repeatability of MS100 is impressive. With a positional repeatability of ±5μm and an accuracy of ±10μm, the machine can produce consistently high-quality results. The unit is equipped with various safety features, such as laser sensors and emergency stop buttons, helping to ensure that operator safety is not compromised. ASM MS 100 is an excellent choice for die attach applications. Its advanced control machine, versatile design, and exceptional accuracy make it an ideal solution for automated die attach processes.