Used ASM MS 896 #9159225 for sale

ASM MS 896 is a die attacher that utilizes state-of-the-art technology for fast mechanical bonding. It is suitable for quick and precise roll-to-roll (R2R) attachment processes and provides a cost-effective, permanent die attachment solution for a wide range of applications. MS 896 has a unique bonding mechanism, based on reversed piezoelectric fine adjustment and a mechanical high speed bonding head, allowing equally fast and precise contact and fastening of components as small as 0.10 mm. The combination of these features enables users to achieve reliable and repeatable performance in higher-volume applications. With its advanced bonding management software, ASM MS 896 provides easy operation and adjustment of the process parameters while monitoring output in real-time. This self-contained, automated machine has an integrated vision equipment, automatic feeder, adjustment system, bonding head, and die peeler. The integrated vision unit confirms the exact location of each die to ensure accurate placement and maximum yield. A built-in feedback loop optimizes and controls the attachment process. The adjustment of the bonding head and the pressure for die attachment can be done with the help of the machine software. MS 896 also has a built-in storage tool that stores all required information for each type of die and the bonding parameters optimized for the desired application. The Bond Management and Defect Tracking software provides detailed analysis of die failure and defect data, enabling instant corrective action to optimize process performance. In addition, ASM MS 896 features a die peeler for efficient in-line die detachment. This allows the user to easily remove defective dies from the process without having to manually sort them. Overall, MS 896 is an innovative die attacher that helps users achieve improved process optimization and reduced operational costs. It is an easy-to-operate automated machine with an integrated vision asset, feeder, and die peeler, enabling fast, accurate, and repeatable die attachment processes. Built-in feedback mechanisms optimize performance, while the Bond Management and Defect Tracking software provides detailed analysis and data output for further processing.