Used ASM MS 896 #9313388 for sale

Manufacturer
ASM
Model
MS 896
ID: 9313388
Vintage: 2002
Die sorter Power supply: 110 V, 50/60 Hz 2002 vintage.
ASM MS 896 is a die attacher designed and manufactured by ASM Assembly Systems. It is a fully automated process that can attach dies to substrates with high accuracy and repeatability. The equipment is capable of attaching dies in any size up to 100mm2 with an accuracy of ±1 µm. It uses a die picker to load and unload dies, and a vision-system and a vision-controlled pick-and-place unit to accurately place the die onto the substrate. The vision machine tracks and corrects for any misalignment of the die orientation. It also offers a 'scrap-saving mode' that inspects, corrects and re-places misaligned dies. Once the die is placed on the substrate, a bonder will be used to securely attach the die to the substrate using solder or adhesive. The tool also offers a range of optional features, such as heated soldering heads, heated substrates and vacuum nozzles. These options enable users to achieve a wider range of applications, including attaching components with temperature or pressure-sensitive adhesives and components that require controlled force, such as attaching MEMS components. MS 896 is suitable for a range of industries, including microelectronics, computing, telecommunications, automotive and consumer electronics. It provides users with a reliable and cost-efficient method of attaching dies accurately and efficiently, with a process cycle time of less than 4 seconds. The asset is easy to keep clean thanks to an autoclavable die picker and foot switches that allow a user to quickly enter maintenance mode with minimal effort. Its high level of accuracy and repeatability is ideal for assembling miniature components and components with high-precision applications. Overall, ASM MS 896 is a reliable and precise die attacher that has been designed to meet the needs of multiple industries. With its simple, rapid and accurate operation, the model is ideal for professionals looking to efficiently attach dies onto their substrates with high precision and repeatability.
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