Used ASM MS 896 #9313391 for sale

ASM MS 896 is a compact, die attach machine dedicated to automated die bonding, also referred to as die bonding. Developed by ASM, a leading provider of die bonding equipment, this device is specifically designed for high-volume, high-precision die attachment applications in the electronics industry. MS 896 is an optimal choice for anyone looking for a reliable, high-performance die bonder. It combines sophisticated PC-based control technology with a reliable, proven die bonding process. The result is a machine that can handle the toughest of die-attaching challenges with minimal operator attention. ASM MS 896 offers excellent die bonding speeds, thanks in part to its powerful force motor, allowing it to quickly and consistently place and attach both small and large die on a substrate. By controlling the placement force and temperature of the bond head, the machine is able to ensure that the die will adhere securely to the substrate within an optimal temperature range. The machine also utilizes a vision equipment, combining a camera and proprietary software, to accurately and quickly detect the presence of die. This further enhances the machine's efficiency and repeatability. The vision system can also be used to monitor the quality of the die positioning and attachment process. In addition, the machine's leg detection feature ensures that the die is always correctly verified before bonding. It utilizes a patented laser-based unit that senses the height difference of a die on contact with a substrate and immediately detects any leg misalignment. This saves time by eliminating any need for manual adjustments and ensures that the results meet optimal parameters. Overall, MS 896 die bonder is an exceptional choice for anyone in need of a reliable and high-performance machine for die attachment applications. Thanks to the combination of advanced control and process technologies, it provides excellent die attachment speeds and accuracy with minimal operator attention. The machine also offers valuable features such as vision to monitor the process and leg detection to verify the die positioning. The result is a die bonder that can reliably and quickly handle die attachment jobs with optimal results.