Used ASM MS 896 #9313397 for sale

ASM MS 896 is a die attacher designed for high-speed die bonding operations, allowing for the attachment of wire bonds or die pads to printed circuit boards (PCBs) or other semiconductor devices. The die attacher can be used with a variety of die sizes, including the standard 0.2, 0.3, and 0.5 mm sizes commonly found in integrated circuit (IC) packages. MS 896 uses a motorized assembly head to precisely position and secure each die in place. The die attacher is compatible with both manual and automated wire bonding, thanks to its highly flexible assembly head control system. It is equipped with a binocular microscope for accurate alignment of the die within the device holder and a tool cup that supports up to three different tools simultaneously. The tool cup allows for the precise distribution of flux, solder, and adhesives, ensuring a consistent bond and a reliable electrical connection. ASM MS 896's die assembly head also features a vacuum circuit, making it easy to manipulate the die even when placed in an awkward position. The head helps to reduce insertion force when attaching die pads, by utilizing a patented spring mechanism. This mechanism ensures that the die can be removed from the device holder without placing excessive force on the package or PCB. The die attacher utilizes IC package-specific software and controls to deliver a higher level of accuracy during the bonding process. The software is configured with various parameters for each die type and size, enabling the assembly head to accurately perform the attachment process. The control system also makes it possible to monitor and adjust the speed, temperature, and voltage of the bonding process. This helps to ensure that the die will be securely attached to the PCB without overheating or damaging the die. MS 896 die attacher is a reliable, precise, and high-speed bonding solution designed to meet the needs of a wide variety of IC packages. With a flexible assembly head control system, automated wire bonding capabilities, and IC package-specific software, the die attacher helps to minimize the cost and effort associated with die pad attachment.