Used ASM MS 896 #9313406 for sale

ASM MS 896 is a die attaching equipment that is used to attach electrical circuit components to integrated circuits (ICs) with die bonding or tape automated bonding (TAB) technologies. It is a fully automated device that uses computer vision technology and advanced robotics to increase the accuracy and speed of die attachment. The system is capable of attaching die with a solder-free bonding technique and offering high accuracy and repeatability. MS 896 consists of three main components: the vision, control, and die handling units. The vision unit provides a vision unit with an elliptical digital variable focus lens, an infrared dome light source, and a high-resolution CCD camera with up to 4 megapixel resolution. The control unit is an automated control unit that is capable of controlling every aspect of the attachment process, including the die handling, vision, and bonding process. Finally, the die handling unit is a precision robotic arm that is capable of picking up, positioning, and bonding die onto the IC. ASM MS 896 is designed to provide a fast, accurate, and cost effective process for attaching die onto ICs. The machine is able to accurately place die in a variety of shapes and sizes onto the IC with controlled force and precise alignment. The tool is also designed to offer a high degree of repeatability and speed, with attachments completed in less than one second. The asset is capable of attaching die with a range of insulation materials, including Ag/Pd, solder, and Eutectic. MS 896 model offers users a range of features to provide an efficient die attachment process. The equipment has an integrated vision system to accurately detect the position of die on the IC, and a high-resolution camera to ensure accurate recognition of wiring and components. The robotic arm is capable of positioning die with a precision of +/- 3mm, while the software package provides a range of parameters to adjust the precision and speed of the die bonding process. In addition, the unit also offers an in-built thermal management machine to ensure accurate temperature control of the process and to prevent thermal damage to the die. ASM MS 896 die attachment tool is designed to provide an efficient and cost effective process for attaching die onto ICs. It is able to provide highly accurate placement of die with controlled force and precision alignment, as well as a high degree of repeatability and speed. The asset is versatile and is capable of attaching die with a range of insulation materials, making it well suited for a variety of applications.