Used ASM MS 896A #9168193 for sale

ASM MS 896A is a fully automated die bonding machine for attaching a wide variety of components to substrate or chip carriers on an assembly substrate. This equipment is designed for high-volume production processes in the automotive, consumer electronics, and medical device industries and is suited to both flip chip and chip scale applications. MS 896A utilizes a dual head placement system which allows for more flexibility and higher yield rates due to its increased accuracy in component placement. The two heads are capable of independent operating functions, including pick & place, laser cutting, hot bar bonding, and laser welding. The heads are adjustable and can be set either in front of or behind each other for precision placement. ASM MS 896A offers users a number of different configurations, making it easy to create the optimal process for specific applications. Its advanced control unit is capable of accurately controlling the processes including die placement tolerance, bonding temperature, and dwell time. This ensures a repeatable, high quality process. MS 896A also has several safety features, including smoke sensors, cameras, and a protective enclosure. This ensures a safe and compliant working environment and allows operators to perform their duties without fear of material damage or injury. The machine is also equipped with an integrated alarm tool that signals any issue with the asset's operation, allowing users to quickly and efficiently react to and resolve any issues. ASM MS 896A is capable of handling both bare die and packaged parts with a wide range of component sizes. Furthermore, this machine is equipped with several advanced features including a Wafer map file editor, laser calibration tooltip and fiducial recognition software. This allows operators to quickly and accurately set up and adjust the placement path according to the needs of each application. The model is easy to program and maintain, and its ergonomic design ensures comfortable and safe operation. MS 896A is ideal for high-volume production processes in the automotive, consumer electronics, and medical device industries, as well as for general attachment of components to substrate or chip carriers.