Used ASM MS 899 #102230 for sale
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ID: 102230
Vintage: 2006
LED Chip sorter
Die size handling:
Standard 9x9 mil to 150x150 mil
Optional 6x6 mil to 450x450 mil
Wafer size up to 4.2"
Bin block Standard 24
(Optional configurable 8, 16 & 32)
High speed sorting
Sorting cycle time:<220ms
Implementing direct drive motor pick and place motion
Supporting various configurations for different meeds
Flexible "plug & sort" bin block arrangement
Input and output wafer frames handling sysytem
Achieving factory automation
Advanced die surfacer inspection
2006 vintage.
ASM MS 899 is a highly advanced die attacher designed to facilitate the joining of separate dies onto circuit boards and other electrically conductive surfaces. It is capable of applying adhesive bonding and thermal bonding to precision dies and comprises a digital rotary drive module, which allows for the precise placement of the die. MS 899 die attacher also includes an adhesive/thermal bonder to complete the joining process. ASM MS 899 die attacher is engineered with a compact and ergonomic design that is easy to use and manage. It includes a two-step pitch adjustment mechanism, enabling fine and precise die placement, as well as a digital display to monitor real-time performance information during the process. The built-in components of MS 899 die attacher are designed to simplify the process of attaching die to any electrically conductive surfaces. It is equipped with a motion control system, which precisely controls the speed, direction, and torque of the rotary drive module. In addition, it also features an integrated air supply, which ensures a sufficient amount of pressure to press the die onto the surface. Overall, ASM MS 899 die attacher is an efficient die bonding solution that is both reliable and flexible. Not only does it help to reduce the time and cost involved in the die attachment process, but it also ensures a precise and secure connection between different components. The integrated bonding adhesive of MS 899 die attacher can be used for a variety of applications, including memory chips, processor chips and other small components, providing a reliable and long-term connection.
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