Used ASM MS 899 #9053213 for sale

ASM MS 899 is a state-of-the-art die attacher specifically designed for discrete semiconductor die application. It features lightning-fast cycle times, precise placement of dies, and integrated vision alignment for accurate die positioning. ASM MS-899 is a versatile, high-speed die bonding equipment that is ideal for multiple HV, LV, and flip chip processes. It can accommodate various die sizes from 0201 to 28mm and feature multiple tooling options including: pick-up cece tray, die attachers, manual pick-up heads, vacuum and softearest pick-ups. MS 899 is equipped with a powerful 3-axis Cartesian motion system which offers a wide range of motion options including high speed linear and rotary movements. The X and Y axis provide speeds of up to 2000 mm/sec and the the Z-axis can be set up to 600 mm/sec. This advanced motion unit is driven by a superior and reliable servomotor technology which ensures a reliable and accurate die bonding process. MS-899 features an integrated vision machine which provides accurate alignment in both X and Y axis. This eliminates operator intervention and offers excellent throughput and control. The vision tool also allows users to quickly adjust the die alignment parameters as needed. In addition, ASM MS 899 offers a user-friendly graphical user interface (GUI) which provides a virtual view of the asset's status and allows users to quickly set up and monitor their process. ASM MS-899 is also offered with various environmental control options including: dust protection, humidity/temperature control, static dissipative protection, and ESD protection. These features ensure a stable thermal environment during die-attachment to reduce the risk of defects. Overall, MS 899 die attacher is an excellent choice for applications requiring high-precision die-attachment processes with minimal operator intervention.