Used ASM MS 899 #9312408 for sale

ASM MS 899 is a state-of-the-art die attacher from ASM, specifically designed for the industry leading MLF packages. It is a semi-automatic inline equipment that provides precise and efficient placement of MLF (MultiLead Flat) and other chip scale packages. ASM MS-899 features an innovative die alignment mechanism that facilitates an accurracy rate of over 99.9%, even making fine adjustments of up to ±25 μm easily achievable. Thanks to its dual linear actuator system, the die attacher can easily adjust to varying chip package band (length and width ranges), even at higher speeds. It also features an advanced unit monitoring and control module, which is able to detect inconsistencies in the alignment of the packages and trigger an alarm for corrective action. MS 899 uses a vacuum pick-up head for die loading and is able to handle up to 8 die types in a single run. The single height pick-up arm, optimized for MLF packages, ensures an enhanced pick-up force for maximum chip package alignment as well as smooth die loading and unloading. MS-899 is easy to set up and requires minimal maintenance. Its sophisticated on-board diagnostics provide useful feedback on machine performance and helps identify any malfunctions so they can be quickly corrected. Thanks to its advanced features and efficient die placement, ASM MS 899 provides a high-quality production solution for chip package placement, specifically for MLF packages. It is the perfect choice for companies looking to streamline their chip packaging processes and maximize production efficiency.