Used ASM MS 899DL #293643381 for sale

ASM MS 899DL Die Attacher is a fully automated, reliable, and robust equipment specifically engineered to attach, monitor and process wire bonding dies accurately to lead frames. The system uses a two-stage die pick-up process that ensures precision die placement and a 10-zone bond parameter verification prior to start of the die attach process. This ensures high accuracy, reliability, and repeatability throughout the entire wire bonding process. ASM MS899-DL is designed for usage in both high-volume and prototype assembly environments. It features a user-friendly programming unit that streamlines the die attacher setup and input validation to simplify operation and improve throughput. The unit is equipped with two independent die handling mechanisms that allow for both manual and automatic die pick-up, positioning and attachment. The machine provides a quick and easy method of changing the height of the die attaching head. This is done using patented liquid leveling aids which maintain consistent die placement, thereby preventing yielded die. The machine also features an advance visual inspection tool which provides real-time images of the die prior to, during and after the die attach process. This helps operators to monitor and adjust the die attachment process as and when required. MS 899 DL can operate at speeds of up to 2,400 parts per hour and it is adjustable for both single- and multi-die frame sizes ranging from as small as 3 x 3 mm to as large as 12 x 12 mm. In addition, the machine also includes advanced auto-teaching and auto-activation features that assist operators in setting up and running multiple die sizes quickly and efficiently. Overall, MS899-DL Die Attacher is engineered to provide the highest quality, reliability and repeatability, while significantly increasing process throughput. In combination with its advanced die inspection asset, user-friendly programming model and wide range of die sizes, the equipment is an excellent choice for any production environment requiring precise and accurate wire bond die attachment.