Used ASM MS 899DL #9350942 for sale

ASM MS 899DL is a top of the line die bonder designed for small and medium-volume production applications. This model of die bonder enables high throughput due to its intelligent motion capability and its ability to achieve consistent bond-pad placement. ASM MS899-DL is designed with a compact footprint and high stability, enabling the machine to achieve high stability during assembly and high placement accuracy. MS 899 DL is a die placarder that is designed specifically for the high precision machining of die-based circuits. The die attach process is applied using an advanced vision-assisted equipment for accurate placement of the wafer on the bond pads. The placement accuracy of the system is 10µm or less across the entire process area. This unit is equipped with manual die placement and/or automated die placement systems that can be chosen depending on the application. MS899-DL is equipped with a high resolution imaging unit for the placement of die-based components. This machine is capable of capturing images of the die to ensure precise placement of the die on the bond pad. The image is then sent to the programmable logic controller (PLC) which controls the motion of the die bonder and ensures accurate placement of the die. ASM MS 899 DL is also equipped with an advanced process control tool. This asset uses software algorithms to detect process anomalies during the die attach process. If any anomalies are detected, an alarm will be triggered to alert the operator. This ensures that the process runs smoothly and that there are no defects in the end product. MS 899DL is designed with an intuitive user interface. This interface allows users to easily program the machine and monitor the process parameters during the bond attach process. The user interface also features setup wizards and guided tutorials to help users set up the machine in the most effective way. The user interface also features real-time monitoring of the process parameters to ensure optimal performance. ASM MS 899DL is one of the most advanced models of die bonders available on the market. Its high precision and accuracy make it ideal for small and medium-volume production applications. Its intuitive user interface, advanced process control model, and high resolution imaging equipment make it a top choice for die bonders.