Used ASM MS 899DL #9372713 for sale

ASM MS 899DL is a die attacher used in semiconductor packages for chip attachment. It is a semi-automated bonding machine designed for the needs of the rapidly changing semiconductor industry. ASM MS899-DL features a four-axis positioning equipment for accurate placement and alignment of components. It is equipped with a high-speed, self-teaching linear servo motor system for precise die placement. It is also fitted with a tool-less two-axis stock handling unit for convenient handling and storage of components. MS 899 DL has an integrated terminal controller with an intuitive graphic user interface for easy programming and operation. The controller is compatible with both G-code and EPL2 programming and supports connection to remote controllers for remote monitoring and operation. The die attacher is designed to be compatible with different die sizes, chip types and types of adhesives. It has an automated vision machine for die detection and position alignment, as well as adjustable pressure settings. The customer can also choose from different types of die adhesive masks to match the size of the die. For storage of components, ASM MS 899 DL is equipped with two LED-lit cabinets and an area for waste materials. The cabinets feature adjustable shelves and drawers for organized storage of components and adhesive materials. MS899-DL is equipped with a 3-phase AC power supply and has self-diagnostic capabilities for monitoring machine status and troubleshooting. The die attacher also meets industry safety standards and is designed with safety features such as E-stop, safety doors and covers. Overall, MS 899DL is designed to be a reliable and efficient die attacher that can help increase productivity in the semiconductor industry. It is equipped with a wide variety of features and settings designed to meet the demanding requirements of the semiconductor packaging industry.