Used BESI / ESEC (Die Attachers) for sale

BESI/ESEC is a reputable manufacturer of die attachers that provide efficient and reliable solutions for the semiconductor industry. Their die attachers have gained recognition for their high-quality performance and advanced features. One of the notable advantages of BESI/ESEC die attachers is their ability to accurately position and bond semiconductor dies onto substrates or packages. These die attachers are equipped with advanced technology, ensuring precise alignment and bonding to meet the demanding requirements of semiconductor assembly. BESI/ESEC die attachers offer improved productivity and yield due to their high-speed and high-accuracy placement capabilities. They are designed to handle various applications, including flip chip, chip on chip, and multi-die stacking. Some examples of BESI/ESEC die attachers include the 2008 xP3, 2008 SC3 Plus, and 2100 HS. The 2008 xP3 die attacher offers exceptional accuracy and flexibility, enabling precise placement of dies onto substrates with maximum throughput. The 2008 SC3 Plus die attacher provides high-speed placement capabilities, making it ideal for high-volume production. The 2100 HS die attacher offers a combination of speed and precision for demanding die bonding applications. Overall, BESI/ESEC die attachers provide semiconductor manufacturers with reliable and efficient solutions to achieve precise and high-quality die attachment, resulting in improved productivity and yield.