Die attachers, manufactured by Canon and NEC, are high-quality and reliable tools used in the semiconductor industry for mounting integrated circuit (IC) chips onto substrates. These die attachers, also known as chip bonders, provide precise and efficient packaging solutions. The die attachers offered by Canon and NEC have numerous advantages. Firstly, they feature advanced analogues that enable accurate and stable placement of IC chips, ensuring optimal electrical connections and reducing the likelihood of defects or failures. The analogues are designed to handle a variety of chip sizes and types, providing versatility for different application requirements. Additionally, these die attachers offer high-speed and high-precision bonding capabilities, allowing for efficient production processes. They boast exceptional temperature control systems and vision systems that ensure precise alignment and bonding of the chips. Some notable examples of die attachers from Canon and NEC include the Bestem D10SP, BESTEM-D01R, and Bestem-D01 models. The Bestem D10SP is designed for high-speed placement with unmatched accuracy, enabling a stable and efficient production process. The BESTEM-D01R offers advanced features such as an automatic recognition system for various chip sizes and superior temperature control. The Bestem-D01 is a versatile model suitable for a wide range of applications, providing excellent bond quality and consistent performance. Overall, Canon and NEC die attachers are renowned for their reliability and precision, making them ideal choices for semiconductor manufacturers seeking efficient and high-quality bonding solutions.