Used CASCADE MICROTECH / ALESSI (Die Attachers) for sale

Cascade Microtech, now part of the larger corporation Alessi, is a leading manufacturer of die attachers, specializing in advanced semiconductor packaging equipment. These die attachers are designed to provide a precise and reliable connection between the semiconductor chips and the package, ensuring optimal performance and durability. One of the notable die attachers offered by Cascade Microtech/Alessi is the CM 300-S RDL. This die attacher utilizes a patented process called reflowed dip attach (RDA) to achieve high-performance die attachment. The RDA process ensures a strong bond between the chip and the package, resulting in improved electrical and thermal conductivity. The CM 300-S RDL also offers flexibility with a wide range of chip and package sizes. The die attachers from Cascade Microtech/Alessi have several advantages. They offer high accuracy, enabling precise alignment and attachment of the chips. Their advanced processes ensure consistent bonding quality and high yield rates. In addition, these die attachers feature advanced control systems, allowing for automation, reduced cycle times, and improved productivity. Cascade Microtech/Alessi's die attachers have found applications in various industries, including automotive, telecommunications, consumer electronics, and medical devices. Some examples of the company's die attachers are the CM Series and the Opti-AIM Series, which offer different capabilities depending on the specific requirements of the semiconductor packaging process. Overall, Cascade Microtech/Alessi's die attachers are known for their precision, reliability, and advanced features, making them a preferred choice for semiconductor manufacturers seeking high-quality die attachment solutions.