Used DATACON / BESI (Die Attachers) for sale

Die attachers manufactured by DATACON / BESI are high-quality machines used in the semiconductor industry for die attachment processes. These machines are designed to effectively and efficiently bond semiconductor chips to their respective packages or substrates. One of the key advantages of DATACON / BESI die attachers is their advanced technology and precision. These machines are equipped with high-speed and high-accuracy placement systems, allowing for precise positioning of the die during the attachment process. This ensures optimal bond strength and alignment, resulting in improved overall product quality. DATACON / BESI offers a range of die attachers, including the 2200 APM, 2200 Evo, and 2200 APM+. The 2200 APM is a high-speed, fully automated die bonder that provides accurate and fast die placement, with a placement accuracy of 5 μm. The 2200 Evo is a versatile platform that offers a wide range of bonding technologies and flexibility in handling different sizes and types of dies. The 2200 APM+ is an upgraded version of the 2200 APM, featuring enhanced performance and capabilities for even higher productivity. These die attachers by DATACON / BESI are widely used in various applications and industries, such as automotive, consumer electronics, and telecommunications. They have proven to be reliable and efficient solutions for die bonding processes, helping manufacturers improve production throughput, reduce costs, and enhance product performance.