Used ESEC 2004 #31306 for sale

ESEC 2004 is a die attacher, manufactured by ESEC Corporation, that is used in die assembly applications. 2004 is a high speed, cost-effective solution for the attachment of dies to substrates. It is capable of up to 100 die attachments per minute with minimal operator assistance. ESEC 2004 is designed to have maximum flexibility and accommodate a wide variety of dies and substrates. It can bond dies with various sizes and shapes such as QFPs, PLCCs, BGA, and CerDIPs. It can also bond to substrates such as ceramic, Aluminum Nitride, and glass composite. 2004 can be programmed to accurately bond to the substrate's specific die and substrate combination. ESEC 2004 uses an air pressure die attach system that helps ensure high accuracy and repeatability. The head of the unit contains a pressure sensor that can detect variations in pressure. This helps to ensure that the same pressure is applied to each die attachment. 2004 also uses precision tooling to ensure that the dies are accurately placed and aligned. ESEC 2004 includes a vision system that is capable of identifying the exact boundaries and position of the dies to be attached. This helps to ensure that all dies are attached perfectly lined up with the substrate. The vision system also uses a series of sensors to detect die position errors and alert the operator if necessary. 2004 is a compact, easy to use device. It has a small footprint and is designed for integration into automated production environments. The product is reliable and highly accurate, making it an ideal solution for dieattachment and die assembly applications.