Used ESEC 2004 #9198993 for sale

ESEC 2004 is a die attach equipment designed for the efficient and accurate attachment of a small die to a larger substrate. It has an ergonomically designed platform with mechanical and electrical components that enable the application of the glue without contact or spillage of the material. The system is equipped with temperature control and has a built-in pressure sensor to ensure that all the steps of the assembly are correctly monitored. 2004 is also equipped with a vision unit for precise alignment, and a fully automated die handling machine. The tool is designed to improve the efficiency of die attach processes. The asset has a 6-level vacuum platform, adjustable die force, and temperature control up to 200°C. ESEC 2004 can handle die sizes from 1mm to 4mm and can accommodate wafer thicknesses up to 15mm. It also has a full range of tooling and programmable heights for placing and attaching the die to the substrate. The vision systems on 2004 are implemented to accurately detect misalignment of die and to facilitate their placement on the substrate. The vision model consists of an encoder, a camera, and a guide rail with an adapter for accurate alignment. The encoder and the camera take measurements and images of the die and substrate to determine the best placement and orientation for die attachment. ESEC 2004 is based on an advanced intelligent controller that uses sensor data to maintain the processes within the equipment. It is equipped with a user-friendly interface and a real-time feedback system for monitoring parameters. 2004 also has programmable parameters and settings that can be saved for future reference. The unit also has a built-in recipe editor and user-friendly settings for quick process setup and production. ESEC 2004 die attach machine is a reliable and efficient solution for attaching small dies to larger substrates. With its advanced features, such as precise alignment, temperature control, and programmability, 2004 is capable of meeting the requirements of a wide range of applications. The tool enables users to efficiently and accurately attach die and ensure that all components of the assembly are correctly monitored.