Used ESEC 2005 APLF #9178429 for sale

ESEC 2005 APLF is a die attacher that has been specifically developed to provide superior quality bonding of dies to substrates. This equipment provides both security of die attach in the long-term and high speed of die attach process. The APLF is equipped with advanced HF automated die bonder, with improved precision and accuracy, designed with advanced technologies of high frequency (HF) automated die placement and soldering processes. It utilizes an advanced HF die attacher that utilizes a magnetic field to precisely align the die and substrate, ensuring repeatable placement with high accuracy and precision. The APLF ensures the highest standards of repeatable and reliable bond integrity for a wide range of applications. Designed with a high degree of process control, the system does not require any additional manual setup or intervention, allowing for shorter relocation times and more reliable operation. The unit's optics also enables the highest precision and accuracy when placing the dies onto the substrates. With its optimized design, the APLF can bond up to 4 dies per second with even the smallest dies, and with up to 300 per minute with standard size dies. The machine is designed to minimize material loss and to improve bond stability. Its bond tool utilizes a high-frequency sintering process, which increases the adherence of the die and substrate, resulting in longer-term reliability and improved performance. The process is designed to be stable with low maintenance requirements, ensuring consistency over long production runs and reduced downtime. Additionally, the asset allows flexibility to run heterogeneous die handoff applications with both automated and manual processes, and with the right tools in place, the APLF can achieve higher levels of throughput and accuracy. Furthermore, the model is designed with comprehensive process control systems for monitoring and recording all necessary parameters of the die attach process, providing detailed reports and real-time information. The APLF also operates with a wide range of HF generative applications and compatible with a variety of HF-controlled systems, providing several options for configuration and integration. Overall, with its comprehensive design, 2005 APLF die attacher provides users with a reliable and repeatable die-attach process, enhanced fidelity with a high degree of accuracy and precision, short relocation times, reduced maintenance, and comprehensive process control and monitoring tools.