Used ESEC 2005 HR #9221258 for sale

ESEC 2005 HR is a high-speed die attacher that provides simultaneous die bonding capabilities for a wide range of substrates such as single- and multi-die devices and flip chips. ESEC 2005HR is designed to attach very small and very thin microelectronic components, such as semiconductor chips, to wafers or substrates. 2005 HR features a modified swing-arm die handler, which provides a high speed, precise and repeatable drop and pick-up. With the advanced cycle time, parts can be correctly placed and processed in milliseconds. The machine also offers a wide range of available tools, allowing it to handle single and multi-die devices, flip chips, and a wide variety of other substrates. 2005HR features an advanced control system that provides great accuracy and repeatability to simplify the entire die attaching process. The settings can be fine-tuned with the help of automatic, manual or hybrid operating modes. This ensures that parts are correctly placed and processed within the optimal cycle time. ESEC 2005 HR can be easily integrated into existing production lines. ESEC 2005HR features a range of advanced features and customizable silicone compression and flattening modules to maximize process throughput. The advanced silicone compression and flattening modules can be tailored to virtually any substrate, enabling faster operations and consistency across devices and batches. 2005 HR also offers an integrated, high-speed camera system which monitors die placement and substrate registration. As a result, the machine can "see" and instantly fine-tune strategies for each substrate. This helps to reduce reject levels and guarantee a flawless and consistent die-attaching process. 2005HR is part of ESEC portfolio, and is both cost-effective and versatile, making it a great choice for laboratories and manufacturers interested in die attaching. The intuitive user interface is user-friendly and enables personnel to get quickly up to speed with the machine. In addition, ESEC 2005 HR features a wide range of advanced options, giving it the flexibility to handle a wide range of substrates while providing superior accuracy, repeatability, and speed.