Used ESEC 2005 HR #9381899 for sale

ESEC 2005 HR is a die attacher from ESEC, a leading provider of hardware and software solutions for the semiconductor industry. This device is designed to effectively attach semiconductor or indium dies used for device packaging. With its reliable and straightforward die handling process, this reliable investing is simple and efficient for all levels of packaging and die-attaching challenges. ESEC 2005HR die attacher is equipped with a standard two-axis motion platform for accurate and repeatable pick, place, attach and bond operations. It also features simultaneous X-Y-Z alignment using an industry-grade Heidenhain DRO controller for even greater die placement accuracy. Its high-speed vision system is capable of scanning over 300 chips per second, ensuring fast and accurate die attachment. With its flexible vision control and processing modes, the device is suitable for a wide variety of application-specific requirements. The main body of the device is composed of an aluminum alloy frame and features a work area size of 35 cm x 35 cm. Its long life and durable operation offers greater reliability with a long-term use. To further optimize its performance, the device is also equipped with a permanent magnet as well as an electromagnet that can be adjusted to enable reliable pick and place operations in any mode. The die-attaching process is further enhanced by the inclusion of the "die-tacking" feature which allows for attaching of two dies simultaneously with one motion system. This makes the device suitable for a number of different die-tacking and bonding applications. Additionally, its advanced software interface allows for performances setting such as speed limits and processes control. This ensures a reliable and stable performance even during high-speed operations. In conclusion, 2005 HR die attacher provides reliable and straightforward die-handling performance for all semiconductor and indium die-attaching needs. With its superior motion platform, such as advanced vision, scanning and process control capabilities, the device ensures optimal performance for a wide range of applications. Its robust nature allows for a long term use, thus ensuring that it offers lasting value for any assembly and die-attaching task.