Used ESEC 2005 HR #9407428 for sale

ESEC 2005 HR is an automated die attacher developed by the company ESEC, which specializes in wire bonders. The machine is capable of bonding silicone dies to its carrier substrates in fewer than seven seconds. The system is equipped with dual vision cameras that enable accurate die placement and features a two-stage bonding process for optimal integration of the die in the substrate. ESEC 2005HR comes with a combination of up to four-position feeder modules, allowing for a fast and accurate placement of dies. The feeder modules have a bottom section which houses multiple reels of dies, and a top section in which a pick and place mechanism is responsible for alignment and placement of the dies. Both the bottom and top sections are connected to the vision cameras, which inspect the position and manage the data associated with every die placement. Due to its well-designed integration of different components, 2005 HR boasts reliable performance and time-efficiency. For example, the vision cameras are mounted on a lateral moving arm that swivels around the pick and place arm, in order to closely inspect the position of the die during placement. The robot arm can then be precisely adjusted in order to ensure an exact die placement. The machine also features established electrical parameters, including an adjustable voltage output from 1.0V to 4.0V. Together with software programs that allow for optimal adjustment of the process parameters in order to achieve ideal bonding performance, 2005HR guarantees efficient and accurate die placement. Aside from its impressive technical features, the die attacher is designed to comply with internationally accepted safety standards. The vision cameras' technology allows the operator to monitor the entire process in real time without any risk of contamination of delicate dies. The two-stage bonding process further reduces the possibility of defective bonds and ensures consistent uniformity of each bond. In conclusion, ESEC 2005 HR from ESEC is an automated die attacher that efficiently bonds silicone dies onto respective carrier substrates. The machine features various components such as dual vision cameras, feeder modules and a two-stage bonding process, along with adjustable voltage output and safety measures, thus making it the ideal choice for various die-bonding operations.