Used ESEC 2005 #128281 for sale

ESEC 2005
Manufacturer
ESEC
Model
2005
ID: 128281
Die bonders.
ESEC 2005 die attacher is an automated die loading equipment designed for attaching components onto printed circuit boards (PCBs). It can be used for both through-hole and surface mount component types of various sizes, including fine-pitched devices. It is an economical solution for assembling an assembly of multiple dies with any amount of activity. 2005 offers the user up to five different attachment modes, allowing for multiple die types to be managed in the same system. These include manual, semi-automatic, and automatic attachment modes to meet the needs of any user. The design of the machine allows for faster component attachment speeds, increased reliability, and quick die changeover times. Additionally, ESEC 2005 is designed to be simple and easy to use. The user interface is intuitive and flexible, and the user can easily change the settings for each component or die. The core component of 2005 unit is the die-attaching head that utilizes a die-attaching pin head mechanism to secure the component onto the printed circuit board. The unique design of the attachment pin head and its shape permit the application of an assembly with a wide range of component sizes (from 0.6mm - 6.0mm) and different types of attachment pad sizes. The mechanism securely fastens the component to the printed circuit board while maintaining the same force applied before and after the die is loaded onto the board. ESEC 2005 also includes a vacuum machine to assist with the positioning of the component onto the printed circuit board. The vacuum tool is customizable, allowing users to easily adjust the vacuum strength to fit the different component sizes and PCB types. To ensure accuracy when loading the components, 2005 uses a vision-guided asset for component-to-board alignment. The vision model is capable of recognizing the component's exact location, accurate to less than 100 microns, to guarantee that the component is precisely placed on the board. ESEC 2005 is capable of loading one to four dies simultaneously from a single pick-and-place head and can support a maximum of four pick-and-place heads. In addition, 2005 also has an integrated workbench for die inspection and positioning. ESEC 2005 is compact, reliable, and easy to use, making it one of the best automated die attach systems available. Its features, such as the vision equipment and multiple attach modes, make it an ideal choice for assembling various assemblies with multiple die types. It is highly modular and provides quality die-to-board connections with consistent placement accuracy.
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