Used ESEC 2005 #158116 for sale

ESEC 2005 is an industrial die-attaching equipment that is used to securely attach dies onto flat surfaces such as printed circuit boards. It is designed for reliable and cost-effective operation. The system is especially suited for attaching power dies and modules such as flip-chips, multi-chip packages, and SSOPs. 2005 has a highly sophisticated design which is capable of forming close contact between leadframes and Flat Leadframes. This design allows for a reliable connection with fine leads and a good die-to-lead alignment without any bridging issues. To ensure high process yields, ESEC 2005 is fitted with a vision unit that automatically identifies and selects flux wicking pads to perform a uniform distribution of the flux before die-attaching. The vision machine can also detect and reject misaligned dies while guiding them through replenishment or reject stations when needed. The die-attaching process is carried out in three steps allowing for accurate positioning of the die relative to the leadframe with a minimum 0.1mm gap ensuring a low contact resistance and high electrical performance. The doughnut-like bonding head presses the die down onto the flux-coated substrate with a variable force. As the die is placed onto the substrate, adhesive is dispensed onto the area and cured while a high frequency signal is applied to the process, providing excellent electrical and mechanical contact. 2005 supports advanced monitoring and control functionalities such as die pre- and post heating, pre- and post fluxing, real-time die temperature adjustment, and re-flow duration adjustment. With the tool's adjustable process parameters, it can customize and optimize the die-attaching process for different applications. In addition, the asset offers a wide array of adjustable parameters which allows users to customize the process for their specific needs. ESEC 2005 is designed for industrial and research environments, and provides reliable and cost-effective performance for high-reliability die-attaching to printed circuit boards. The versatile and adjustable design means it can be tailored to suit specific production requirements and processes. With the monitoring and recording functionalities, the model supports improved product quality and efficiency while reducing production costs.