Used ESEC 2005 #293640181 for sale

ESEC 2005 die attacher is a precision die attach equipment designed to meet the specific needs of modern electronics manufacturing. It is an advanced, cost-effective solution for attaching dies on to a wide range of substrates, including ICs (Integrated Circuits) and PCBs (Printed Circuit Boards). This die attacher is equipped with a vacuum chuck system which supports a wide variety of substrates, and its advanced ECU (Electronic Control Unit) ensures precise control of the die attach process. The unit is designed to minimize the total cycle time, minimize contamination, and minimize the overall cost of production. The die attach head is designed with a robust, low-tolerance design for reliable and repeatable performance. The positioning accuracy of the head is up to 0.0005" (0.01mm) with a dynamic repeatability of 0.0001" (0.002mm). The machine also has thermal rollers to provide uniform heat distribution to the die during the attach process. 2005 die attacher has an integrated vision tool which ensures accurate die alignments and visual feedback of the die position. It also has an advanced software package which provides powerful die handling capabilities and improved control of the die attach process. With its reliable and efficient die attach capabilities, ESEC 2005 die attacher can achieve high levels of throughput and cost savings compared to traditional methods of manual die attach. The die attacher is compatible with a range of substrates, including rigid materials such as ceramic, glass, and plastic, and flexible materials such as plastic film, kapton and others. The asset also has a vacuum control model, which provides excellent performance even at high vacuum levels. 2005 die attacher can also be used with multiple substrates such as ceramic tape and sticky tape. To reduce costs and improve performance, ESEC 2005 die attacher is equipped with dual-zone temperature control and a high-abrasion resistant metallized chuck plate. This ensures a uniform die attach temperature that can easily be adjusted in accordance with the substrates being used. Additionally, the metallized chuck plate offers a longer life span than traditional beryllium copper or aluminum chucks. In conclusion, 2005 die attacher is an advanced die attach solution that is designed for reliability and repeatability. Its sophisticated ECU and vision equipment make it ideal for applications that require accuracy and high-throughput performance. The system also has a vacuum chuck unit and dual-zone temperature control capabilities that make it highly suitable for a variety of substrate materials.