Used ESEC 2005 #9222415 for sale

ESEC 2005 is an automated die attacher designed to allow for fast and accurate die-bonding of a printed circuit board (PCB) to a substrate material. It uses a combination of both force and temperature-controlled die bonding processes to achieve die-bonding with maximum efficiency. 2005 housing is designed to protect the interior components at all times, as well as to provide a stable platform for die attachment. The casting is made from aluminum, which assures the machine's rigidity and durability. The machine consists of 3 major parts - an Optical Head, Heat Tunnel, and Vacuum Head. The Optical Head is used to accurately align and attach the die to the substrate in the correct locations. It has adjustable image magnification and lighting to ensure a precise alignment of the die. The Heat Tunnel is used to control the temperature of the die and the substrate to optimize the die-bonding strength and consistency. It has an array of temperature regulating nozzles and a temperature monitoring system. The Vacuum Head is used to create a vacuum between the die and substrate so that the adhesive can bond them effectively without any air pockets. ESEC 2005 is a highly efficient die-bonding system with repeatability down to 0.050mm. It also has a wide temperature range of 0 to 200°C for most die types, allowing for an optimal bond to be created. The die-bonding machines is able to work with a wide variety of substrates such as ceramic, plastic, and aluminum. Along with precise die attachment, the machine also offers quick cycle time for higher efficiency, as well as an optional automatic tape unwinder and autofeed that make operation easier. The die-bonder's intuitive design means it requires minimal training, leading to increased production throughput and improved quality of the finished product. 2005 Die Attacher is an essential machine in modern electronics production. It offers a combination of precise control and robust design, combined with a simplified operation, making it a reliable and efficient choice for die-bonding processes.