Used ESEC 2006 HR #9219705 for sale

ESEC 2006 HR Die Attacher is an automated die bonding machine designed for efficient operation of large production facilities. It offers a fully automated, highly accurate method of die attaching, enabling the fast and efficient production of wafers, BGA, and LED packages. 2006 HR features a high-speed pick and place robot with advanced accuracy for picking and positioning substrates and dies. It is capable of precisely positioning die with pitch and orientation accuracy in the range of ±25 µm and ±0.5 degrees, respectively. The robot controller utilizes a vision equipment with a color frame camera for die recognition and substrate flatness checking. The die attach head is a vacuum based system that works in conjunction with the feeder unit to precisely position and attach die to a substrate. ESEC 2006 HR can achieve production throughput of up to 110 wafers per hour with a bond integrity of up to 2.5 gms force. It also features a multi needle die bonder with bonding parameters that can be quickly and easily adjusted through the machine's graphical user interface. 2006 HR is equipped with three independant vision systems to detect die placement failure and 6 independently controlled heaters that enable efficient and fast preheating of substrates and die. ESEC 2006 HR is also designed for simple operation and maintenance. Easy-to-follow instructions are provided on the LCD display. The built-in Automatic Configuration Assistant allows for quick and easy set up when changing substrates or dies. Additionally, it is provided with an emergency power off switch, and an auto-recovery feature that allows for the resumption of production without any manual operations when an emergency power shut off occurs. 2006 HR is an automated, efficient, and accurate die bonding machine that is designed for large-scale production facilities. With its high speed pick and place robot, precise die positioning, multi-needle die bonder, and other features, ESEC 2006 HR provides an efficient and reliable way for fast production of packages and substrates.