Used ESEC 2006 HR #9257729 for sale

ESEC 2006 HR is a sophisticated die attacher designed to meet the exacting requirements of the most advanced semiconductor packages. With its unique design, 2006 HR is capable of accurately attaching die to their respective substrates with pin-point accuracy. ESEC 2006 HR contains two separate components: the Die Attacher Equipment (DAS) and the VC Assist Processor (VCP). The DAS serves to automatically attach the die to their respective substrates, utilizing an array of pre-calibrated sensors, linear motors, and a digital controller for each die. The VCP is an advanced computer system within 2006 HR which allows advanced settings and adjustments to be made directly to the unit. Through the VCP, the user can finely tune the settings of the machine in order to maintain a high level of precision when attaching the die to their respective substrates. The combination of ESEC 2006 HR's components provides users with an unprecedented level of control and accuracy when performing die attachment operations. This level of control allows for precise placement of the die to their respective substrates and ensures that the bond line between the two remains consistent and within the desired specifications. As such, 2006 HR is an ideal choice for the most demanding of die attachment operations. In order to ensure a long and trouble free lifespan, ESEC 2006 HR is built with robust and reliable components including a sturdy metal frame and sealed feed chamber. In addition, the tool offers patented features such as the built-in cooling fan, dual-side optical monitoring, and low-torque motor design which ensure superior operation. This high quality build provides users with a asset that is capable of supporting their operations even in the most demanding circumstances. When it comes to die attachment operations, 2006 HR is an obvious choice. With its superior design and advanced features, ESEC 2006 HR is capable of providing reliable and accurate die attachment operations that meet the exacting requirements of the most advanced semiconductor packages.