Used ESEC 2006 SSI #9071838 for sale

ESEC 2006 SSI die attacher is a specialized machine, specifically designed for attaching dies to substrate materials like printed circuit boards, ceramic substrates, and metal substrates. It can be used to attach a wide variety of different types of dies, ranging from flip chip die to packages, leadframes, and even chip-on-board die. 2006 SSI features an integrated automatic vacuum equipment that allows it to quickly and efficiently attach dies to substrates. The vacuum system can be used in combination with an optional, programmable visual microscope to enhance accuracy. The visual microscope is capable of reading x-y-z coordinates, as well as chip orienation, so it can accurately measure the components of each die. In addition, ESEC 2006 SSI features a programmable heater module that is capable of reaching temperatures of up to 200°C. This allows for precise control of the die-to-substrate bond and ensures a strong bond is created. Furthermore, 2006 SSI features an integrated alignment unit for accurately positioning dies on substrates. This alignment machine uses infrared light for detection and is capable of scanning for even the smallest die-to-substrate offset. Finally, ESEC 2006 SSI features a user-friendly Graphical User Interface (GUI) that allows operators to easily access all the settings and options available on the machine. This GUI also provides all the necessary data logging for traceability and quality assurance purposes. 2006 SSI die attacher is a highly reliable and accurate machine that is capable of fulfilling all the attachment needs of modern electronic manufacturing facilities. It's easy to set up and operate, and it can easily handle a wide variety of different types of dies.