Used ESEC 2006 #9108954 for sale

ESEC 2006 is an advanced die attacher that is used to mount bond frames, modules and components onto printed circuit boards (PCBs). It utilizes a vacuum pick-up tool that is able to accurately pick-up die from reels and place them into the desired location on the printed circuit boards. The die attacher can be configured with either 5 or 10 pick-up arms and the die placement speed can be adjusted depending on the particular application. 2006 die attacher is designed to accurately, accurately and reliably attach die to all types of printed circuit boards without damaging the delicate components. It is also capable of attaching different sizes of die from larger lead frames to the smaller dies used in high density modules. The die is mounted on the board with precisely-defined parameters and the placement accuracy is guaranteed to be within 0.01mm. The pick-up arms of ESEC 2006 are designed to be able to sensoe different types of die, including the most common types such as BEOL dies, TAB dies, and flip chip dies. The pick-up tool utilizes a vacuum to pick-up and deposit die onto the board and the strength of the vacuum can be adjusted to achieve the desired placement accuracy. The die attacher can also be equipped with fail-safe sensors that will stop the motion of the pick-up tool if a die fails to attach. 2006 die attacher is a robust and reliable solution for PCB die mounting and die placement. The pick-up head is easily adjustable and the vacuum strength adjustable to ensure accurate die placement and minimal stress on the components. Furthermore, the software-controlled vacuum strength can be adjusted to accommodate different sizes of die and the integrated fail-safe sensors guarantee a high quality finish. ESEC 2006 is therefore a highly versatile die attacher that is suitable for a wide range of PCB applications.