Used ESEC 2007 BGA (D138) #161960 for sale

ESEC 2007 BGA (D138) is a high-precision, automated die attacher that provides optimum chip placement accuracy and repeatability for die attach applications. It is designed for mounting and bonding die onto a variety of substrates, including ceramic, plastic and metal substrates. The die attachment can be of any size and is able to be placed with an accuracy of +/-20µm. The flexible substrate clamping mechanism fully supports die sizes from 0.18mm up to 40mm while being fast and accurate. The 2007BGA Die Attacher includes a reliable and precision positioning equipment as well as a unique squeegee feature that allows user to easily remove excess solder liquid. The robust control system includes an easy to use touch-screen interface which permits the user to effortlessly adjust machine parameters and monitor the performance of both die and substrate placement. The intuitive graphical user interface (GUI) is fully programmable, allowing users to speed up the production process while still maintaining accurate placement accuracy. The 2007BGA also offers a range of features that ensures accurate and repeatable die placement, such as a vacuum unit with automatic die sensing, a stepper motor for accurate die placement, and a three-axis motion machine. This highly accurate motion tool can be programmed to provide up to five separate E-axis tool shifts, allowing for flexible and repeatable die placement on a variety of substrates. The die placement accuracy is further enhanced by the high repeatability of the stepper motor, resulting in a highly successful process. The 2007BGA also features a robust heating asset, where the substrate and die are heated by a digital temperature controller, to ensure accurate and repeatable placement. The digital temperature controller can be programmed to maintain the pre-set temperature profile during the die attach and cooling cycles. Additionally, the heat is spread evenly across the substrate and die, ensuring repeatable performance without hot spots or delayed cooling cycles. Overall, ESEC 2007BGA (D138) is a reliable and accurate die attacher, capable of providing excellent chip placement accuracy and repeatability for a variety of substrates. The flexible substrate clamping model and robust control equipment ensure consistent results, while the intuitive GUI allows users to easily configure and monitor the die attach process. Furthermore, the robust heating system guarantees accurate and repeatable placement with no hot spots.