Used ESEC 2007 BGA #192447 for sale

ESEC 2007 BGA is a state-of-the-art die attacher for use in frequency and analog applications. The equipment is designed to deliver precision and reliability in wire bonding applications. 2007 BGA system consists of three main components: an advanced wire-bonding head, a precision die aligner, and a digital control unit. The wirebonding head is designed for die attachment and wire placement with minimal disturbances. The wirebonder is equipped with a 18-gauge needle and a precise optical bonding microscope. The microscope offers a resolution of up to 20 microns per frame and can be used for precise alignment and placement of the bond wire. The die alignment unit is designed for precise placement of the die package without disturbing the bond wires or adjacent components. The machine utilizes a precision vision tool for auto-alignment of the die package. The precise alignment ensures that the die package is placed optimally for re-bond or repair. The control unit for the asset is based on advanced digital technology and provides sophisticated data acquisition and control functions. The unit includes a graphic user interface, an efficient program selection for various wire bonding applications and a real-time diagnostic model. The control equipment is also designed to allow remote operation of the machine, enabling it to be easily integrated into global production systems. ESEC 2007 BGA is ideal for applications requiring high-precision die placement and reliable wire bonding. The system is suitable for use in both production and development environments. The robust design and advanced components ensure consistent performance and longer life span, making it a perfect choice for precision die attachment and wire bonding applications.