Used ESEC 2007 BGA #9212495 for sale

ESEC 2007 BGA is a type of die attacher that is designed to allow accurate, cost-effective, and reliable attachment and removal of semiconductor dice and components. It is a multi-function machine that incorporates the capabilities of a dispensing equipment, a die-attach system, and post-attach inspection. 2007 BGA utilizes lead-free and RoHS compliant flux, and laser technology in order to precisely attach each component. It features automatic placement of BGA components and tape-on-reel as well as attach windows for components that are deemed too large. Additionally, the machine uses feed forward placement control to accurately place components, and optical alignment to ensure optimal placement of components. The die-attach unit is equipped with dual pick-and-place heads to simultaneously attach and inspect BGAs and components, while the post-attach machine auto-inspects each component. The die attach tool of ESEC 2007 BGA consists of three stages. The first stage pre-attaches the components to ensure the adhesive is applied. Next, the laser is used to accurately position the BGA onto the board. Finally, a vacuum is used to pick and attach the component, and then the post-attach asset verifies the successfulness of the attachment. The post-attach model uses both X-ray imaging and 3D AOI technology to inspect each component once it is placed. The X-ray equipment combines cutting-edge technology and custom pattern matching algorithms to ensure 100% accuracy when inspecting attaching components. On the other hand, the 3D AOI system performs three-dimensional inspections of BGAs to detect misalignments, insufficient solder paste or flux, and improper tacking. 2007 BGA is an excellent choice for attaching semiconductor dice and components due to its accuracy, low cost, and reliability. The use of multi-functional functionality, such as the fluxing and inspection stations, as well as the dual pick-and-place head allows for efficient attachment and accurate alignment of components. Additionally, the X-ray imaging and 3D AOI technology featured in the post-attach unit ensures that components are properly attached.