Used ESEC 2007 BGA #9212496 for sale

ESEC 2007 BGA (Ball Grid Array) die attacher is a highly precise, automated equipment designed to improve the attachment of integrated circuit dice onto the substrate of a printed circuit board. It is an essential tool utilized in the assembly of electronic devices, and its purpose is to ensure that each die is accurately placed and tightly secured in its correct position. The system consists of a mounting unit and a vision alignment unit. The mounting unit is designed to hold the dice in position at their precise attachment points, enabling them to quickly attach to the substrate. The vision alignment machine is used to check the accuracy of the die placement against a reference point on the board, prior to attaching. This ensures that any slight misalignments in the position are detected and corrected before mounting. The mounting unit incorporates an electromechanical head, a vacuum pick-up tool, and an end effector. The electromechanical head is responsible for providing accurately controlled force when attaching the dice, while the vacuum pick-up asset ensures that each die is correctly positioned and securely held in place prior to attachment. The end effector is a spring-loaded block which applies force to the dice while in contact with the substrate, firmly securing them in their intended positions. The vision alignment model features a camera and a precision vision equipment software, used to check and adjust the positioning of the dice prior to mounting. The camera captures images of the board and the dice in three-dimensional space, enabling the software to compare the exact position of each die against a reference point on the board. Using a combination of manual and automated adjustment techniques, the image of the dice is gently shifted to align them with the correct location on the board. Overall, 2007 BGA die attacher provides a reliable and easy-to-use tool for completing accurate spacecraft/electronic board assembly. Its precise force control and vision alignment system ensure each die is accurately placed and firmly secured in its intended position, thus improving the safety and reliability of the assembly process. In this way, the unit can be used to rapidly produce high-quality circuitry, ensuring a better performance from the completed boards.