Used ESEC 2007 BGA #9212498 for sale

ESEC 2007 BGA (Ball Grid Array) is a die attacher used in the manufacturing of electronic components. It is a semi-automated die-bonding equipment used to attach Ball Grid Array (BGA) packages to device substrate. 2007 BGA is designed to support a wide variety of BGA sizes and pitches, including 0.5mm to 2.5mm pitch solder balls. It is a cost-effective solution for assembling device packages with high accuracy and quality. ESEC 2007 BGA consists of four main components: an epoxy application system, an alignment unit, a die attach module, and post-processing module. The epoxy application machine consists of a reciprocating die holder, a spring-loaded syringe, and a programmable control unit. This allows for exact application of die attach epoxy material in a consistent mark pattern onto the substrate. The alignment tool is used to precisely align the die to the substrate. It consists of a vision asset with a microscope, and can accurately measure the x-y coordinates of the die's die-pads relative to the substrate's solder balls. The die attach module is the primary workstation which picks-up and places the die onto the substrate. It contains a Vacuum Pick-up Model to pick-up and position the die and a Vacuum Placement Equipment to place the die in its predetermined location. Lastly, the post-processing module can be used to fine-tune the placement of the die after it has been placed. It consists of both a Resin Epoxy Dispensing Unit and a Bubble Removal System. 2007 BGA has a total cycle time of 8 seconds, with an accuracy of +/- 0.02mm. This unit is capable of producing BGA packages with high quality and reliability. Additionally, the package can be heated to 110°C to reduce any deformations or creasing that may occur during placement or attachment. ESEC 2007 BGA is an excellent die-attaching solution that allows for high-precision production of Ball Grid Array (BGA) packages. It is capable of achieving high accuracy and quality with its quick cycle time and efficient die placement systems. Additionally, it is designed to support a broad range of BGA sizes and pitches, making it an ideal solution for the production of today's ever-shrinking electronic devices.