Used ESEC 2007 BGA #9212499 for sale

ESEC 2007 BGA is a specialized industrial die attacher that is used for attaching semiconductor dies to printed circuit boards (PCBs) and other electronic components for assembly in the semiconductor industry. The BGA uses an electrostatic motorised pick and place method for attaching the dies which ensures a highly accurate and repeatable process. The BGA has a pick and place speed of up to 5 parts/second and is capable of attaching die sizes ranging from 240um x 240um to 16mm x 16mm. The die can be placed in a range of pitches from 0.3mm to 5.0mm and the BGA is able to accurately and effectively place die on substrates that have been pre-drilled with a typical placement accuracy of +/- 0.1mm. The BGA is equipped with advanced vision systems for detecting and measuring dies, and is also capable of calculating placement position when using fiducial marks. The BGA is designed with multiple tooling options to support a range of die sizes and shapes, and can be equipped with different kinds of die pick up methods such as vacuum, needle, and blade pick up tools. The BGA is also fitted with a leveler tool dispenser which is used to spread an even amount of adhesive on the die. The BGA is also equipped with advanced safety features to protect the operator and prevent possible injury from machine operation. These include automatic safety door locks, emergency stop buttons, and light curtains. 2007 BGA is a reliable and precise die attacher that is widely used in the semiconductor industry. It is capable of accurately and effectively attaching die to substrates with a range of pitches and die sizes. The advanced safety features help to make the machine usage safe and secure for the operators and ensure high levels of production and quality.