Used ESEC 2007 BGA #9212500 for sale

ESEC 2007 BGA (Ball Grid Array) die attacher is a specialized machine used in the electronics assembly industry that attaches components onto printed circuit boards. It is designed for high-precision placement of small components, such as miniature ball-grid arrays, which are commonly used to connect chips and integrated circuits to PCBs. The BGA die attacher uses a bench-top model that can be loaded with components at the top and operated by a simple operator interface. The machine is composed of three main parts - a feeder, a placement head and a control equipment. The feeder provides the BGA components to the placement head. It consists of a vibratory bowl to sort the BGAs into the correct orientation before placement. The placement head uses a vision system to accurately locate and pick up the BGAs. It consists of a vision camera, air blast nozzle and mounting arm. After the vision unit finds the part, the mounting arm places it onto the PCB by sweeping along a pre-programmed path. The operator interface allows the user to precisely control the feed rate, position, and placement force of the BGA. The placement arm is also capable of placing two BGA's at the same time. The control machine of the BGA die attacher consists of a CPU, a motion control tool, a PLC and a vision asset. The CPU communicates with the motion control model and the PLC to control the feeder and placement head. It also reads and interprets the commands from the operator interface. The PLC controls the motion of the placement head in response to input from the vision equipment. It also synchronizes the placement head with the speed of the feeder. The vision system is used to accurately locate and pickup the BGAs. It also interfaces with the control unit to provide feedback. 2007 BGA die attacher is an efficient and accurate machine that is capable of performing high-precision work. It is well-suited to the assembly of small components, such as mini-BGAs. This machine is reliable and easy-to-use, making it an ideal choice for any electronics assembly production.